Electrical Potting Compound

The strongest of the potting compounds epoxies are rigid and wear resistant.

Electrical potting compound.

Potting encapsulation casting compound meets uv 94v 0 flame retardant specifications. Convenient one to one mix ratio by weight. Outstanding electrical insulation characteristics. Serviceable from 51 c to 90 c.

It is non corrosive to copper minimal exotherm and very low shrinkage making it well suited for potting and bonding electronic and electrical components. As a result heat is dissipated within the enclosure and rapidly conducted to the heat sink which has enabled substantial size and weight reductions of the finished component. Electrical and electronic potting compounds are designed to insulate and protect electrical and electronic components from the application and environmental stresses. We offer a comprehensive selection of low cost epoxy and polyurethane potting compounds to meet the most demanding specifications.

In electronics potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge for resistance to shock and vibration and for the exclusion of water moisture or corrosive agents. 3m scotch weld epoxy potting compound dp270 is low viscosity for easy dispensing and potting. The potting compound fills the component enclosure entirely leaving no air gaps. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits.

Tough seal potting compound tough seal is a superior family of key sealants for potting electrical and electronic components that provides a reliable grip and exceptional encapsulating protection for any potting application where premium thermal cycling performance excellent thermal shock resistance and outstanding environmental and corrosion protection are a must. Epoxy potting compounds mg chemicals offers a wide range of epoxy potting compounds for protecting printed circuit boards and electronic devices. Features a non halogen filler. Epoxy potting compounds encase electronic assemblies in a layer of epoxy for protection from dust chemicals moisture mechanical shock and vibration.