Electrical Potting Material

They are used in low medium high voltage applications and feature outstanding electrical insulation properties superior adhesive strength thermal stability and superb chemical resistance.

Electrical potting material.

Products provide reliable long term performance for microelectronic electronic electrical devices components including. Our line of products consists of epoxies silicones polyurethanes and uv curable systems. Epoxy potting compound epic 0154 is a low temperature heat cure thermally conductive epoxy potting compound for electrical components. All of the materials are electrically insulating with high dielectric strength and excellent high temperature stability.

Amazon s choice for electrical potting compound mg chemicals 832hd black 1 1 epoxy encapsulating and potting compound 25 milliliters dual dispenser 4 2 out of 5 stars 57. Epic 0154 features good electrical properties minimal settling characteristics and good heat transfer in a single component epoxy. Thermosetting plastics or silicone rubber gels are often used though epoxy resins are also very common. Aerospace sealants electrical potting molding pr 1535 potting and molding compound pr 1535 is a high hardness potting and molding compound.

Electrical and electronic potting compounds are designed to insulate and protect electrical and electronic components from the application and environmental stresses. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits electrical insulation enhanced mechanical strength heat dissipation vibration shock resistance corrosion protection. In electronics potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge for resistance to shock and vibration and for the exclusion of water moisture or corrosive agents. Lord thermoset tm sc 400 silicone encapsulant is a clear soft gel with low thermal conductivity 0 1 w m k used for potting sensitive electronics where high dielectric strength and very low mechanical stress are desired.